MediaTek introduces Dimensity 9200+ for flagship phones

Dimensity 9200+

MediaTek just announced its flagship SoC Dimensity 9200+ for smartphones. Dimensity 9200+ is the successor to Dimensity 9200 which was introduced back in November last year.

Dimensity 9200+ is built-on second-generation TSMC’s 4nm process. It has an octa-core processor with 1 ultra-core Arm Cortex-X3 clocked at up to 3.35GHz, 3 x Arm Cortex-A715 super-cores running up to 3.0GHz, and 4 x Arm Cortex-A510 efficiency cores running at 2.0GHz. It boasts 10% faster performance and 11% better efficiency as compared to Dimensity 9200.

The SoC includes Arm Immortalis-G715 GPU clocked at 1150MHz and boasts a 17% performance boost compared to the Dimensity 9200.

Dimensity 9200+ has a 6th generation AI Processing Unit (APU 690), MediaTek Imagiq 890 image signal processor, MediaTek MiraVision 890, and MediaTek 5G UltraSave 3.0.

It also includes a 4CC-CA 5G Release-16 modem that switches between long-reach sub-6GHz and superfast mmWave connections. It also supports Wi-Fi 7 and Bluetooth 5.3.

MediaTek Dimensity 9200+ Specifications

SpecificationsMediaTek Dimensity 9200+
CPU1x Arm Cortex-X3 @ 3.35GHz
3x Arm Cortex-A715 @ 3GHz
4x Arm Cortex-A510 @ 2GHz
GPUArm Immortalis G715 GPU
Raytracing
DisplayMaximum On-Device Display support: FHD+ @ 240Hz
WHQD up to 144Hz
5K (2.5kx2) up to 60Hz
AI6th Gen APU (APU 690)
35% faster performance in ETHZ5.0 benchmark over 5th gen
MemoryLPDDR5X (8533Mbps)
ISP18-bit HDR ISP
4K HDR video on 3 cameras simultaneously
Native RGBW sensor support
Up to 12.5% power savings recording 8K with EIS
ModemSub-6GHz + mmWave ready
Throughput: 7.9Gbps
4CC Carrier Aggregation
8CC mmWave
MediaTek 5G UltraSve 3.0
ConnectivityBluetooth 5.3
Wi-Fi 7 up to 65 Gbps
Wireless Stereo Audio
Manufacturing processTSMC’s N4P 2nd Gen 4nm process

Smartphones powered by Dimensity 9200+ are expected to release this month. iQOO has already confirmed that the upcoming iQOO Neo series phone will be the first smartphone to pack this chip.

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