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Differences Between DDR3 and DDR4 RAM

Differences Between DDR3 and DDR4 RAM
Deepanker Verma September 16, 2014 Technology

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Kingston observed that the computing and gaming needs are continuously growing in the global landscape. Accelerated adoption of cloud computing, virtualization and high-performance technologies, is on the rise. Hence, the limits of the DDR3 memory are being reached more often with real time analytics, high end gaming, server critical applications, processes requiring higher data consumption, etc.
Kingston DDR4 RAM
Kingston has always been on the forefront for Innovation. This time, we have showcased DDR4 – a new technology in Memory. For now, DDR4 supports only Intel’s X99 chipset (found on Intel, Gigabyte & ASUS motherboards) and Intel Haswel-E processor. We showcased the prototype during CES 2014 and have plans for the commercial launch soon.
DDR4 has:
  1. Higher frequency range available (1600Mhz to 3200Mhz)
  2. Higher bandwidth (by 50%)
  3. Higher Density of 4GB to 16GB (DDR3 has 512MB to 8GB)
  4. Lower voltage (standard with 1.2V, can go lower to 1.1V and even 1.05V)
  5. Lower power Consumption (not only due to the lower voltage)
 Structural Changes:
  1. Different location of the key notch (So not compatible with the DDR3 motherboards)
  2. Thicker than DDR3
  3. The PCB has slightly curved edges
 
Overall (all these changes will lead to):
  1. Greener Technology
  2. Better Hardware configuration to showcase
  3. Much Higher Performance
  4. Faster Processing Speed
  5. Smoother use of Enterprise Applications
  6. HD gaming is easier

 Here is a list of More Specific Distinctions Between DDR3 and DDR4 (More Technical):

 
DescriptionDDR3DDR4Advantage
Chip Densities512Mb-8Gb4GB-16GBLarger DIMM Capacities
Data Rates800Mb/s – 2133Mb/s1600Mb/s – 3200Mb/sMigration to Higher-Speed I/O
Voltage1.5V1.2VReduced Memory Power Demand
Low Voltage StandardYes (DDR3L at 1.35V)Anticipated at 1.05VMemory Power Reductions
Internal Banks816More Banks
Bank Groups (BG)04Faster Burst Accesses
VREF inputs2 – DQs and CMD/ADDR1 – CMD/ADDRVREFDQ Now Internal
tCK – DLL Enabled300MHz – 800MHz667MHz – 1.6GHzHigher Data Rates
tCK – DLL Disabled10MHz – 125MHz (optional)Undefined to 125MHzDLL-off now fully supported
Read LatencyAL + CLAL + CLExpanded Values
Write LatencyAL + CWLAL + CWLExpanded Values
DQ Driver (ALT)40Ω48 ΩOptimal for PtP Applications
DQ BusSSTL15POD12Less I/O Noise and Power
RTT Values (in Ω)120, 60, 40, 30, 20240, 120, 80, 60, 48, 40, 34Support for Higher Data Rates
RTT Not AllowedREAD BurstsDisables during Read BurstsEase-of-Use
ODT ModesNominal, DynamicNominal, Dynamic, ParkAdd’l Control Mode; OTF Value Change
ODT ControlODT Signaling RequiredODT Signaling NOT RequiredEase of ODT Control; Allows Non-ODT Routing, PtP Apps
Multi-PurposeRegisterFour Registers – 1 Defined, 3 RFUFour Registers – 3 Defined, 1 RFUProvides Additional Specialty Readout
DIMM TypesRDIMM, LRDIMM, UDIMM, SODIMMRDIMM, LRDIMM, UDIMM, SODIMM
DIMM Pins240 (R, LR, U); 204 (SODIMM)288 (R, LR, U); 260 (SODIMM)
RASECCCRC, Parity, Addressability, GDMMore RAS features; improved data integrity

 

Author:

Vishal Parekh, Marketing DirectorThis guest post on DDR4 is written by Mr. Vishal Parekh, Marketing Director, Kingston Technology – India.

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Deepanker Verma

About the Author: Deepanker Verma

Deepanker Verma is the Founder and Editor-in-Chief of TechloMedia. He holds Engineering degree in Computer Science and has over 15 years of experience in the technology sector. Deepanker bridges the gap between complex engineering and consumer electronics. He is also a a known Security Researcher acknowledged by global giants including Apple, Microsoft, and eBay. He uses his technical background to rigorously test gadgets, focusing on performance, security, and long-term value.

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