Kingston observed that the computing and gaming needs are continuously growing in the global landscape. Accelerated adoption of cloud computing, virtualization and high-performance technologies, is on the rise. Hence, the limits of the DDR3 memory are being reached more often with real time analytics, high end gaming, server critical applications, processes requiring higher data consumption, etc.
Kingston has always been on the forefront for Innovation. This time, we have showcased DDR4 – a new technology in Memory. For now, DDR4 supports only Intel’s X99 chipset (found on Intel, Gigabyte & ASUS motherboards) and Intel Haswel-E processor. We showcased the prototype during CES 2014 and have plans for the commercial launch soon.
DDR4 has:
- Higher frequency range available (1600Mhz to 3200Mhz)
- Higher bandwidth (by 50%)
- Higher Density of 4GB to 16GB (DDR3 has 512MB to 8GB)
- Lower voltage (standard with 1.2V, can go lower to 1.1V and even 1.05V)
- Lower power Consumption (not only due to the lower voltage)
Structural Changes:
- Different location of the key notch (So not compatible with the DDR3 motherboards)
- Thicker than DDR3
- The PCB has slightly curved edges
Overall (all these changes will lead to):
- Greener Technology
- Better Hardware configuration to showcase
- Much Higher Performance
- Faster Processing Speed
- Smoother use of Enterprise Applications
- HD gaming is easier
Here is a list of More Specific Distinctions Between DDR3 and DDR4 (More Technical):
Description | DDR3 | DDR4 | Advantage |
Chip Densities | 512Mb-8Gb | 4GB-16GB | Larger DIMM Capacities |
Data Rates | 800Mb/s – 2133Mb/s | 1600Mb/s – 3200Mb/s | Migration to Higher-Speed I/O |
Voltage | 1.5V | 1.2V | Reduced Memory Power Demand |
Low Voltage Standard | Yes (DDR3L at 1.35V) | Anticipated at 1.05V | Memory Power Reductions |
Internal Banks | 8 | 16 | More Banks |
Bank Groups (BG) | 0 | 4 | Faster Burst Accesses |
VREF inputs | 2 – DQs and CMD/ADDR | 1 – CMD/ADDR | VREFDQ Now Internal |
tCK – DLL Enabled | 300MHz – 800MHz | 667MHz – 1.6GHz | Higher Data Rates |
tCK – DLL Disabled | 10MHz – 125MHz (optional) | Undefined to 125MHz | DLL-off now fully supported |
Read Latency | AL + CL | AL + CL | Expanded Values |
Write Latency | AL + CWL | AL + CWL | Expanded Values |
DQ Driver (ALT) | 40Ω | 48 Ω | Optimal for PtP Applications |
DQ Bus | SSTL15 | POD12 | Less I/O Noise and Power |
RTT Values (in Ω) | 120, 60, 40, 30, 20 | 240, 120, 80, 60, 48, 40, 34 | Support for Higher Data Rates |
RTT Not Allowed | READ Bursts | Disables during Read Bursts | Ease-of-Use |
ODT Modes | Nominal, Dynamic | Nominal, Dynamic, Park | Add’l Control Mode; OTF Value Change |
ODT Control | ODT Signaling Required | ODT Signaling NOT Required | Ease of ODT Control; Allows Non-ODT Routing, PtP Apps |
Multi-PurposeRegister | Four Registers – 1 Defined, 3 RFU | Four Registers – 3 Defined, 1 RFU | Provides Additional Specialty Readout |
DIMM Types | RDIMM, LRDIMM, UDIMM, SODIMM | RDIMM, LRDIMM, UDIMM, SODIMM | |
DIMM Pins | 240 (R, LR, U); 204 (SODIMM) | 288 (R, LR, U); 260 (SODIMM) | |
RAS | ECC | CRC, Parity, Addressability, GDM | More RAS features; improved data integrity |
Author:
This guest post on DDR4 is written by Mr. Vishal Parekh, Marketing Director, Kingston Technology – India. |