After several teasers, Realme has confirmed that it will launch its next flagship smartphone Realme GT5 Pro in China on December 7. The company will host the launch event in Shenzen, China, at 2 PM (CST) to announce specs and pricing details. The phone is being developed under the philosophy ‘No Leap, No Launch’ and promises to be a dual-engine powerhouse.
The phone will be powered by Snapdragon 8 Gen 3 Mobile Platform to provide powerful performance. The phone will feature a Sony IMX890 1/1.56-inch sensor. It has OIS+EIS for powerful stabilization and 3x optical zoom. Realme also mentioned that the camera will feature 4-in-1 multi-pixel fusion technology.
The company also confirmed to have an IMX890 super-light periscope telephoto lens that claims to be an ‘amazing telephoto lens.’ The phone will offer up to 120x digital zoom and up to 120x super zoom along with a powerful OIS+EIS stabilizing system. It boasts a super-core telephoto imaging system that supports DOL-HDR on the telephoto segment for the first time.
The phone is said to have the industry’s first stainless steel grid design that is strong and wear-resistant. It has been perfectly integrated with the radial texture in the lens. Realme says that the high strength of stainless steel requires high processing which adds to the cost but is worth it.
Realme has also partnered with US-based ArcSoft for superior computational photography capabilities.
The phone will also be launched in global markets, but we don’t have any details for it.
