MediaTek Dimensity 900 6nm SoC with Dual SIM 5G support announced
MediaTek has announced its new Dimensity 900 5G SoC built on 6nm e TSMC process technology. It is said to be the success ro MediaTek Dimensity 820 SoC that was based on 7nm architecture. Dimensity 900 will soon hit the market in mid-range smartphones.
The SoC has an octa-core CPU with two Arm Cortex-A78 cores clocked at up to 2.4GHz and six Arm Cortex-A55 cores clocked at up to 2GHz.The Soc is integrated with ARM Mali-G68 MC4 GPU, an independent artificial intelligence (AI) processing unit, and MediaTek’s HyperEngine gaming engine.
The SoC supports FHD+ 120Hz display with MediaTel MiraVision HDR video technology. It also supports real-time SDR to HDR conversion and enhanced HDR10+ video playback.
In terms of connectivity, it supports Wi-Fi 6, True Dual SIM 5G, 5G New Radio (NR) sub-6GHz modem with carrier aggregation, and Voice over New Radio (VoNR).
It supports LPDDR4x and LPDDR5 RAM. The SoC can also be paired with UFS 2.1,UFS 2.2, and UFS 3.1 storage.
It supports up to 108 MP primary camera or 20+20 MP dual cameras. It also supports hardware 4K HDR video capture and can decode 4K 30fps HEVC/H.264/VP9 video and encode 4K at 30fpps HEVC/H.264.