Mediatek has introduced a new mobile platform Dimensity 8200. Dimensity 8200 is built on the 4 nm process technology and promises a flagship-level experience to premium smartphones.
Dimensity 8200 is built on a 4nm process. It includes an octa-core CPU where one Arm Cortex-A78 core runs at 3.1GHz, three Arm Cortex-A78 cores run at 3.0GHz, and four efficiency Arm Cortex-A55 cores run at 2.0GHz.
The mobile platform also includes Mali-G610 GPU to handle graphics. It also uses MediaTek’s HyperEngine 6.0 which promises to enhance the gaming experience. It supports Vulkan SDK for raytracing in gaming, FPS improvement, and smart resource optimization.
For AI tasks, Dimensity 8200 also includes MediaTek APU 580. The chip also includes Imagiq 785 ISP that brings the supply for 320MP photos and true-to-life 14-bit HDR video capture on up to 3 cameras.
It features dual-5G connectivity, Wi-Fi 6E, and Bluetooth 5.3. Dimensity 8200 also supports 120Hz WQHD+ and 180Hz FHD+ displays. It also supports MediaTek MiraVision 785 and MediaTek intelligent Display Sync 2.0.
MediaTek Dimensity 8200 Specifications
| Specifications | MediaTek Dimensity 8200 |
| CPU | 1x Arm Cortex-A78 @3.1GHz 3x Arm Cortex-A78 @3.0GHz 4x Arm Cortex-A55 @2.0GHz |
| GPU | Arm Mali-G610 MC6 |
| Display | MediaTek MiraVision 785 FHD+ @ up to 180Hz WQHD @ up to 120Hz MediaTek intelligent Display Sync 2.0 4K AV1 Video Decoding |
| AI | MediaTek APU 580 |
| Memory | Quad-channel LPDDR5 |
| ISP | MediaTek Imagiq 785 14-bit HDR ISP Up to 320MP Primary Camera Triple camera, dual exposure HDR videography 4K60 Video Capture |
| Modem | 3GPP Release 16 5G Modem MediaTek UltraSave 2.0 3CC Carrier Aggregation (200MHz) 5G sub-6GHz |
| Connectivity | Bluetooth 5.3 Wi-Fi 6E 2×2 Wi-Fi/Bluetooth hybrid coexistence design |
| Manufacturing process | TSMC N4 (4nm-class) |
iQOO Neo7 SE is the first phone powered by Dimensity 8200. The phone has already been announced in China earlier today. Xiaomi will also use the phone in the upcoming Redmi K60E phone.
