MediaTek has announced its latest flagship SoC Dimensity 9000. It is the first mobile chipset built on TSMC’s 4nm process. The SoC also uses Arm’s new version 9 architecture.
Dimensity 9000 SoC features Armv9 architecture that includes one Arm Cortex-X2 core clocked at 3.05GHz, three Arm Cortex-A710 cores clocked up to 2.85GHz, and four Arm Cortex-A510 cores. The SoC also includes the latest ARM Mali-G710 graphics processor. Arm Mali-G710 GPU claims a 20% better performance than its predecessors in graphics and gaming. It supports LPDDR5x 7500Mbps RAM and includes 14MB of cache.
Dimensity 9000 SoC has 18-bit HDR-ISP design that allows HDR video capture on three cameras at the same time. The SoC also supports a 320-megapixels camera on a smartphone. It also has ‘Super Night Video Recording’ for recording videos at night. There is a new six-core fifth-generation AI processing unit that promises 4x power efficiency as compared to the last generation. The SoC supports a full-HD+ display with a 180Hz refresh rate.
Dimensity 9000 SoC comes with Bluetooth 5.3 Wi-Fi 6E 2×2, Wireless Stereo Audio, and Bediou III-B1 C GNSS support for connectivity.
SoC | Dimensity 9000 |
CPU | 1x Cortex-X2 @ 3.05GHz 1x1024KB pL2 3x Cortex-A710 @ 2.85GHz 3x512KB pL2 4x Cortex-A510 @ 1.80GHz 4x256KB pL2 8MB sL3 |
GPU | Mali-G710MP10 @ ~850MHz |
Memory Controller | 4x 16-bit CH @ 3200MHz LPDDR5 / 51.2GB/s @ 3750MHz LPDDR5X / 60.0GB/s 6MB System Cache |
ISP | Imagiq790 New-gen Triple 18-bit ISP 9GPix/s processing throughput Single Sensor up to 320MP Triple Sensor 32+32+32MP |
NPU | 5th Gen 4+2 core APU |
Media | 8K30 & 4K120 encode & 8K60 decode H.265/HEVC, H.264, VP9 8K30 AV1 Decode |
Modem | (LTE Category 24/18) (5G NR Sub-6) |
Manufacturing Process | TSMC N4 |
MediaTek confirms that DImensity 9000 SoC will arrive sometime in later Q1 2022.