MediaTek introduces Dimensity 6100+ 6nm 5G SoC. The SoC features an integrated 5G modem supporting 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation. It also has MediaTek UltraSave 3.0+.
Dimensity 6100+ comes with two Arm Cortex-A76 cores clocked at up to 2.2GHz and six Arm Cortex-A55 efficiency cores clocked at 2GHz. It has Mali-G57 MC2 GPU for handling graphics. The SoC supports up to 16GB LPDDR4x RAM and up to 1TB UFS 2.2 storage. It also has MediaTek HyperEngine 5.0 gaming technology for a smooth gaming experience.
The SoC supports up to 120Hz Full HD+ 10-bit AMOLED display and 1.07 billion wide color reproduction ability. It also supports up to 200MP single camera or 3x 64MP cameras with its 2x 14-bit ISP.
It offers 5G Sub-6, Wi-Fi 6E, Bluetooth 5.3, GPS, and NFC connectivity.
It also comes with MediaTek UltraSave 3.0+ technology for improved battery performance. The company claims that this tech can reduce 20 percent 5G power consumption. It also supports up to 2K 30fps video capture, and AI-color tech with Arcsoft, and AI-bokeh.
Smartphones powered by Dimensity 6100+ SoC will be available in Q3 2023.
