Mediatek has today announced three chipsets Dimensity 8100, Dimensity 8000, and Dimensity 1300. Dimensity 8100 and Dimensity 8000 are 5nm SoCs. Dimensity 1300 is 6nm SoC.
Dimensity 8100 and Dimensity 8000 SoCs are for premium 5G smartphones. These SoCs also bring Imagiq 780 photo and video capture engine, HyperEngine 5.0, 5th generation AI processor, and Release-16 5G modem.
Dimensity 8100 and Dimensity 8000 are nearly the same. Both the chipsets use the four ARM Cortex-A78 high-performance cores and four Cortex-A55 efficiency cores along with an ARM Mali G610-MC6 GPU. In Dimensity 8000. Cortex-A78 cores are clocked at 2.75 GHz and they are clocked at up to 2.85 GHz in Dimensity 8100.
Both the chips support MiraVision 780 and 168 Hz refresh rate display at FHD+ resolution. Dimensity 8100 SoC also supports 120Hz at WQHD+. These SoCs include Wi-Fi 6E, Bluetooth 5.3, Bluetooth LE, and sub-6 GHz 5G. In terms of memory, they support Quad-channel LPDDR5 memory and UFS 3.1 storage.
Dimensity 1300 has a prime Cortex-A78 core clocked at up to 3GHz, 3x Cortex-A78 regular performance cores clocked at 2.6GHz, and four Cortex-A55 efficiency cores clocked at 2GHz. The chipset also has Arm Mali-G77 MC9 GPU.
The six-core APU 3.0 promises up to 10% improvements for AI tasks. It also has HyperEngine 5.0 integration. The SoC also supports 4K HDR Video with 3-Exposure Fusion. It also includes 5G, Wi-Fi 6 (a/b/g/n/ac/ax), NavIC support and Bluetooth 5.2 connectivity.
Dimensity 8100, Dimensity 8000, and Dimensity 1300 will be available in the first quarter of 2022. A few companies have already confirmed these phones. Realme GT Neo 3, Redmi K50 Pro, and a OnePlus phone will be launched with Dimensity 8100. OnePlus Nord 2T could come with Dimensity 1300.
