At its Product Communication Conference, Popular chipmaker MediaTek announced a new chip MediaTek Dimensity 800 for mid-range and upper mid-range smartphones. It will be available in Q1 2020 and Smartphones powered by MediaTek Dimensity 800 will be coming in Q2 2020.
The company just confirmed the name without revealing a detailed specs sheet. So, we do not know anything about core architecture, clock speed, GPU, and 5G modem used in it. Details are expected to be official next month.
A few reports also claim that Dimensity 800 SoC will carry the model number MT6873. It is also tipped to pack Helio M70 5G modem will come with an octa-core processor with two Cortex A76 high-performance cores and six Cortex-A50 series cores. But we cannot confirm any of these claims. We will have to wait for the next announcement that will surely reveal detailed specs and model number of this chip.
This new chip is tipped to compete against Snapdragon 765 SoC, which is also 5G ready chip for mid-range phones.
MediaTek announced flagship chip MediaTek Dimensity 1000 5G SoC last month. Smartphones with this flagship chip will be coming starting next month. This high-end chip will compete against Exynos 9810 Snapdragon 865 and Huawei’s Kirin 990 SoC.
