Soon after Qualcomm announced its flagship mobile chipset Snapdragon 855 with 5G support, MediaTek has also announced MediaTek Helio M70 5G baseband chipset in China.
MediaTek Helio M70 is a multimode chipset offering 2G/3G/4G/5G-enabled connectivity. MediaTek Helio M70 baseband chipset supports LTE, and 5G dual connectivity and ensures backward compatible in the absence of 5G. It also boasts of the sub-6GHz frequency high power user equipment and more similar features.
It is also designed in compliance with 3GPP Rel-15 new specifications that holds data transfer rate of up to 5Gbps. The Helio M70 uses multi-mode solution that simplifies the design of 5G devices. It enables device makers to design mobile devices with a smaller form factor but with improved energy-efficiency and competitive appearance.
L Lee, General Manager of MediaTek Wireless Communications Division, said, “MediaTek is committed to promoting the adoption of the latest technologies. With the commercialization of the first 5G baseband chipset, Helio M70, consumers will be able to enjoy the exciting 5G experience from a mature and complete solution. In the future, 5G and AI application areas will continue to grow, enhancing the connected experience for users in areas such as mobile phones or smart living.”
This chipset will be shipped next year and is expected to feature in smartphones starting the second half of 2019.
MediaTek also announced its partnership with China Mobile, Huawei, Nokia, NTT DOCOMO and others for establishing a 5G industry ecosystem.
