MediaTek introduces Dimensity 8250 chipset

MediaTek Dimensity 8250 chipset

MediaTek has introduced the Dimensity 8250 chipset designed for premium mid-range phones. Dimensity 8250 seems the refreshed version of Dimensity 8200 that was released back in 2022.

Dimensity 8250 is built on a 4nm TSMC process. It features an octa-core processor that includes 1x Arm Cortex-A78 core clocked at 3.1GHz, 3x Arm Cortex-A78 cores clocked at 3.0GHz, and 4x Arm Cortex-A55 cores clocked at 2.0GHz. It also has an Arm Mali-G610 MC6 GPU to handle graphics. The chipset supports up to quad-channel LPDDR5 6,400Mbps RAM and UFS 3.1 storage.

The SoC also has AI capabilities and can perform dedicated AI tasks and fusion processing. It also has built-in SDR-to-HDR conversion with AI.

The chipset supports up to 120Hz WQHD+ or 180Hz full-HD+ display. It can also process HDR10+ video.

It supports up to 320-megapixel primary camera and can also support a 32-megapixel triple rear camera setup. If paired with a high-resolution main sensor, it can also offer 2x lossless zoom. The SoC can support video recording of up to 4K 60fps video.

The SoC has integrated 5G modem with support for SA, NSA along with 3CC sub-6GHz networks. It also has tri-band Wi-Fi 6E offering a peak downlink speed of 4.7Gbps. There is also support for Bluetooth 5.3.

The first phone with a Dimensity 8250 chipset will be the Oppo Reno12 that’s coming on May 23. Reno12 Pro will come with Dimensity 9200+ Star Speed Edition

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