MediaTek has today announced its latest midrange chipset Dimensity 6300 for affordable 5G phones. It is the successor to Dimensity 6100+ which was launched last year.
Dimensity 6300 is built on TSMC’s 6nm process. It has an octa-core processor that includes 2 Cortex-A76 cores clocked at 2.4GHz and 6 Cortex-A55 cores running at 2GHz. It promises a 10% boost in CPU performance compared to Dimensity 6100+.
The SoC also has Arm Mali-G57 MC2 to handle graphics requirements. Mediatek boasts 50% GPU performance improvements over its predecessor.
The chip supports LPDDR4x RAM and UFS 2.2 storage. It supports a Full HD+ 120Hz display. The SoC supports up to 108MP single camera or 16MP+16MP dual camera.
The chipset supports dual-band Wi-Fi and Bluetooth 5.2. MediaTek Dimensity 6300 comes with an enhanced 5G modem and supports 3GPP Release 16 standard. It offers up to 140MHz 2CC 5G Carrier Aggregation. MediaTek UltraSave 3.0+ technology can save power and increase the battery life.
Realme C65 5G could be the first phone to launch with Dimensity 6300 later this month.
