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Qualcomm announces Snapdragon 865 Plus

Qualcomm announces Snapdragon 865 Plus

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Qualcomm has finally announced the Snapdragon 865 Plus processor for smartphones. The new chip comes with almost 10 percent improvement in performance over the predecessor.

Qualcomm claims that this new chop aims to deliver “increased performance across the board for superior gameplay and insanely fast Qualcomm Snapdragon Elite Gaming experiences, truly global 5G, and ultra intuitive AI.”

There are mainly three improvements in the new chip as compared to Snapdragon 865. The clock speed of Kryo 585 has been boosted up to 3.1GHz. Adreno 650 GPU now offers 10 percent faster graphics rendering. The new chip is also compatible with Qualcomm’s FastConnect 6900, the company’s new Wi-Fi 6 chipsets with 6GHz band capability (Wi-Fi 6E).

So, it can deliver speeds of up to 3.2 Gbps and latency under 3 ms. It also enabled Bluetooth 5.2 with apt X Adaptive for 96 kHz audio. external X55 modem to deliver 5G.The chipset still uses

SoCSnapdragon 865

Snapdragon 865+

CPU1x Cortex A77
@ 2.84GHz 1x512KB pL2

3x Cortex A77
@ 2.42GHz 3x256KB pL2

4x Cortex A55
@ 1.80GHz 4x128KB pL2

4MB sL3 @ ?MHz
1x Cortex A77
3.1GHz 1x512KB pL2

3x Cortex A77
@ 2.42GHz 3x256KB pL2

4x Cortex A55
@ 1.80GHz 4x128KB pL2

4MB sL3 @ ?MHz
GPUAdreno 650 @ 587 MHzAdreno 650 @ ?
DSP / NPUHexagon 698

15 TOPS AI
(Total CPU+GPU+HVX+Tensor)
Memory
Controller
4x 16-bit CH

@ 2133MHz LPDDR4X / 33.4GB/s
or
@ 2750MHz LPDDR5  /  44.0GB/s

3MB system level cache
ISP/CameraDual 14-bit Spectra 480 ISP

1x 200MP

64MP ZSL or 2x 25MP ZSL

4K video & 64MP burst capture
Encode/
Decode
8K30 / 4K120 10-bit H.265

Dolby Vision, HDR10+, HDR10, HLG

720p960 infinite recording
Integrated Modemnone
(Paired with external X55 only)

(LTE Category 24/22)
DL = 2500 Mbps
7x20MHz CA, 1024-QAM
UL = 316 Mbps
3x20MHz CA, 256-QAM

(5G NR Sub-6 + mmWave)
DL = 7000 Mbps
UL = 3000 Mbps
Mfc. ProcessTSMC
7nm (N7P)

Asus has already announced that ROG 3 will be the first phone to come with Snapdragon 865 Plus. ROG 3 is coming later this month.

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Deepanker Verma

About the Author: Deepanker Verma

Deepanker Verma is the Founder and Editor-in-Chief of TechloMedia. He holds Engineering degree in Computer Science and has over 15 years of experience in the technology sector. Deepanker bridges the gap between complex engineering and consumer electronics. He is also a a known Security Researcher acknowledged by global giants including Apple, Microsoft, and eBay. He uses his technical background to rigorously test gadgets, focusing on performance, security, and long-term value.

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