Mediatek just introduced its latest flagship SoC Dimensity 9300 SoC. Dimensity 9300 uses third-generation TSMC’s 4nm process and 2nd gen thermally optimized IC design. Dimensity 9300 is said to be the successor to Dimensity 9200 or Dimensity 9200+.
Dimensity 9300 comes with an octa-core processor that includes 1 x ARM Cortex-X4 performance core clocked at 3.25GHz, 3 x performance core clocked ARM Cortex-X4 cores at 2.85GHz, and 4 x Cortex-A720 efficiency cores clocked at 2.0GHz. Mediatek claims that the new SoC offers 15% better single-core CPU performance and 40% improved multi-core performance compared to Dimesntiy 9200. It also promises 33% less power consumption at peak performance compared to the predecessor.
The SoC comes with a new Immortalis-G720 GPU that promises 46% performance improvement in hardware ray tracing compared to its predecessor. Immortalis-G720 GPU supports a hardware-based ray tracing engine and variable rate rendering technology. MediaTek also claims that the GPU offers 40% less power consumption at the same level of performance as compared to its predecessor.
The APU 790 promises to offer double the AI processing power in integer and floating-point operations with 45% less power consumption. The company has adopted Transformer model for operator acceleration. It has made the processing speed of the APU 790 8 times faster.
The SoC supports LPDDR5T 9600Mbps memory and UFS 4 storage.
Dimensity 9300 supports always-on HDR up to 4k@60fps. It supports WQHD display at 180Hz and 4K up to 120Hz.
The Imagiq 990 offers a new bidirectional direct coupling between ISP and APU. It also has an 18-bit RAW ISP design for AI Semantic Analysis Video Engine with 16 categories of scene segmentation adjustment. It also supports 4K@30fps cinematic mode with real-time bokeh tracking, 4K AI Noise Reduction, and AI processing on RAW photos and videos.
The Dimensity 9300 supports Wi-Fi 7. It also integrated MediaTek Xtra Range Technology for better long-range connectivity. The company also added its Multi-Link Hotspot technology for faster smartphone tethering. It also supports Bluetooth 5.4.
The R16 5G modem supports 4CC-CA Sub-6GHz and 8CC-CA mmWave bands. The modem also promises improved power efficiency with the MediaTek UltraSave 3.0+ technology.
| Dimensity 9200 | Dimensity 9300 | SD 8 Gen 3 | |
| CPU Prime | 1x Cortex-X3 @ 3.05GHz | 1x Cortex-X4 @ 3.25GHz | 1x Cortex-X4 @ 3.3GHz |
| CPU Big | 3x Cortex-A715 @ 2.85GHz | 3x Cortex-X4 @ 2.85GHz + 4x Cortex-A720 @ 2.0GHz | 3x Cortex-A720 @ 3.2GHz + 2x A720 @ 3.0Ghz |
| CPU Efficiency | 4x Cortex-A510 @ 1.8GHz | – | 2x Cortex-A520 @ 2.3Ghz |
| GPU | Immortalis G715 | Immortalis G720 | Adreno 740 |
| RAM | LPDDR5X | LPDDR5T | LPDDR5X |
| Camera | 320MP, 18-bit ISP | 320MP, 18-bit ISP | 200MP, 18-bit ISP |
| Video | 8K @ 30fps, 4K @ 60fps | 8K @ 30fps, 4K @ 60fps | 8K @ 30fps, 4K @ 120fps |
| 5G | sub-6GHz/mmWave (7.9Gbps) | sub-6GHz/mmWave (7.9Gbps) | sub-6GHz/mmWave (10Gbps) |
| Wi-Fi | Wi-Fi 7 (6.5Gbps) | Wi-Fi 7 (6.5Gbps) | Wi-Fi 7 (5.8Gbps) |
| Bluetooth | BT 5.3 | BT 5.4 | BT 5.4 |
Dimensity 9300 should be available in smartphones by the end of 2023. Vivo has already confirmed that its Vivo X100 will be the first phone to use this SoC. The phone will be introduced in China on November 13th. Oppo’s next Find X series phone will also use the Dimensity 9300 SoC.
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