MediaTek has announced two new chipsets in its 7000 series lineup, the Dimensity 7450 and Dimensity 7450X. These are successors to last year’s Dimensity 7400 and 7400X, but this time the company is offering a refresh instead of a major upgrade.
The naming itself makes it clear that this is not a big generational jump. Instead, MediaTek has focused on improving a few key areas while keeping the core hardware mostly the same.
Both Dimensity 7450 and 7450X come with the same octa-core CPU setup as their predecessors. This includes four Cortex-A78 cores clocked at up to 2.6GHz and four Cortex-A55 cores running at 2.0GHz. The GPU also remains unchanged. It is still the Mali-G615 MC2. This means users should not expect a big jump in raw performance compared to last year’s chips.
Both chipsets support LPDDR5 and LPDDR4x RAM. They also support UFS 3.1 storage.
MediaTek says there is a small improvement in AI capabilities. The new chips offer up to 7 percent better AI performance, especially in photography-related tasks. This should help with features like image processing, HDR, and other AI-based camera enhancements. However, this is still a modest upgrade and not something that will drastically change the experience.
The main improvement comes in connectivity. Both chipsets now use a newer 5G modem based on the 3GPP Release 17 standard, replacing the older R16 modem. This new modem brings better power efficiency and improved network performance. MediaTek claims up to 20 percent better performance in transit, which should help users get more stable connections while traveling.
The chips also support 3CC carrier aggregation with up to 140MHz bandwidth, enabling peak 5G download speeds of up to 3.27Gbps. Another improvement is faster network recovery when the device comes out of low-signal or dead zones.
On the local connectivity side, the chips support Wi-Fi 6E and Bluetooth 5.4, along with MediaTek’s Network Observation System that helps switch between networks more smoothly.
The main difference between the two models is display support. The Dimensity 7450X is designed for devices with dual displays. This makes it suitable for flip-style foldable smartphones in the affordable segment. They support up to WFHD+ resolution at 120Hz or Full HD+ at 144Hz. Apart from this, both chipsets are largely identical in terms of performance and features.
For cameras, the chips can handle sensors up to 200MP and support 4K video recording at 30fps with HDR and electronic image stabilization.
Smartphones powered by the new Dimensity 7450 and 7450X chipsets are expected to launch in the coming months.
| Feature | Dimensity 7450 | Dimensity 7450X |
|---|---|---|
| CPU Architecture | 4× Cortex-A78 @ 2.6GHz + 4× Cortex-A55 @ 2.0GHz | 4× Cortex-A78 @ 2.6GHz + 4× Cortex-A55 @ 2.0GHz |
| Total Cores | 8 (Octa-core) | 8 (Octa-core) |
| GPU | Mali-G615 MC2 | Mali-G615 MC2 |
| Process Node | 4nm-class | 4nm-class |
| AI Engine | 6th Gen NPU, up to 7% AI boost | 6th Gen NPU, up to 7% AI boost |
| 5G Modem | 3GPP Release 17 (SA/NSA, Sub-6GHz) | 3GPP Release 17 (SA/NSA, Sub-6GHz) |
| Peak 5G Speed | Up to 3.27Gbps (3CC, 140MHz) | Up to 3.27Gbps (3CC, 140MHz) |
| Power Efficiency | Up to 20% better in 5G scenarios | Up to 20% better in 5G scenarios |
| Wi-Fi | Tri-band Wi-Fi 6E (2T2R) | Tri-band Wi-Fi 6E (2T2R) |
| Bluetooth | Bluetooth 5.4 | Bluetooth 5.4 |
| RAM Support | LPDDR5 / LPDDR4x up to 6400Mbps | LPDDR5 / LPDDR4x up to 6400Mbps |
| Storage Support | UFS 3.1 / UFS 2.2 | UFS 3.1 / UFS 2.2 |
| Camera Support | Up to 200MP, 12-bit HDR ISP | Up to 200MP, 12-bit HDR ISP |
| Video Recording | 4K @ 30fps, HDR, EIS | 4K @ 30fps, HDR, EIS |
| Display Support | WFHD+ @ 120Hz / FHD+ @ 144Hz | Dual display support (foldables) + WFHD+ @ 120Hz / FHD+ @ 144Hz |
| Special Feature | Improved network recovery, better transit performance | Dual-display optimization for flip foldables |
| Target Devices | Mid-range smartphones | Foldable smartphones (especially flip-style) |
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