MediaTek just announced its flagship SoC Dimensity 9200+ for smartphones. Dimensity 9200+ is the successor to Dimensity 9200 which was introduced back in November last year.
Dimensity 9200+ is built-on second-generation TSMC’s 4nm process. It has an octa-core processor with 1 ultra-core Arm Cortex-X3 clocked at up to 3.35GHz, 3 x Arm Cortex-A715 super-cores running up to 3.0GHz, and 4 x Arm Cortex-A510 efficiency cores running at 2.0GHz. It boasts 10% faster performance and 11% better efficiency as compared to Dimensity 9200.
The SoC includes Arm Immortalis-G715 GPU clocked at 1150MHz and boasts a 17% performance boost compared to the Dimensity 9200.
Dimensity 9200+ has a 6th generation AI Processing Unit (APU 690), MediaTek Imagiq 890 image signal processor, MediaTek MiraVision 890, and MediaTek 5G UltraSave 3.0.
It also includes a 4CC-CA 5G Release-16 modem that switches between long-reach sub-6GHz and superfast mmWave connections. It also supports Wi-Fi 7 and Bluetooth 5.3.
MediaTek Dimensity 9200+ Specifications
| Specifications | MediaTek Dimensity 9200+ |
|---|---|
| CPU | 1x Arm Cortex-X3 @ 3.35GHz 3x Arm Cortex-A715 @ 3GHz 4x Arm Cortex-A510 @ 2GHz |
| GPU | Arm Immortalis G715 GPU Raytracing |
| Display | Maximum On-Device Display support: FHD+ @ 240Hz WHQD up to 144Hz 5K (2.5kx2) up to 60Hz |
| AI | 6th Gen APU (APU 690) 35% faster performance in ETHZ5.0 benchmark over 5th gen |
| Memory | LPDDR5X (8533Mbps) |
| ISP | 18-bit HDR ISP 4K HDR video on 3 cameras simultaneously Native RGBW sensor support Up to 12.5% power savings recording 8K with EIS |
| Modem | Sub-6GHz + mmWave ready Throughput: 7.9Gbps 4CC Carrier Aggregation 8CC mmWave MediaTek 5G UltraSve 3.0 |
| Connectivity | Bluetooth 5.3 Wi-Fi 7 up to 65 Gbps Wireless Stereo Audio |
| Manufacturing process | TSMC’s N4P 2nd Gen 4nm process |
Smartphones powered by Dimensity 9200+ are expected to release this month. iQOO has already confirmed that the upcoming iQOO Neo series phone will be the first smartphone to pack this chip.