Mediatek has just announced its flagship chipset Dimensity 9000+. Dimensity 9000+ comes with a 5% butter CPU performance and 10% graphics performance over its predecessor Dimensity 9000.
Dimensity 9000+ is built-in 4nm TSMC processor. It comes with Cortex-X2 high-performance core clocked at 3.2 GHz, three Cortex-A710 cores clocked at 2.85GHz, and four high-efficiency Cortex-A510 cores. It has Arm Mali-G710 MC10 graphics and HyperENgine 5.0. It has the same integrated LPDDR5X RAM with 8MB L3 CPU cache and 6MB of system cache that was in Dimensity 9000 chipset. The SoC also has MediaTek APU 590.
“The advanced CPU architecture and Arm Mali-G710 MC10 graphics processor built into the new chipset provide more than a 5% boost in CPU performance and more than 10% improvement in GPU performance,” said the company.
The chipset supports up to 320MP primary camera and features an 18-bit HDR-ISP fusion. The MiraVision 790 supports WDHD+ displays with 144Hz refresh rates or 180Hz at FHD. The Wi-Fi display supports up to 4K60 for HDR video.
The 5G modem has been improved with up to 7Gbps downlink using 3CC carrier aggregation. It also supports Wi-Fi 6E and Bluetooth 5.3. Mediatek has also included MediaTek’s 5G UltraSave 2.0 power-saving enhancement suite for improved efficiency.
MediaTek claims that Dimensity 9000+ will make its way to smartphones as soon as Q3 of this year.